发明名称 |
Method for manufacturing semiconductor device, method for processing substrate, substrate processing apparatus and recording medium |
摘要 |
There is provided a method for manufacturing a semiconductor device, including forming a thin film containing a specific element and having a prescribed composition on a substrate by alternately performing the following steps prescribed number of times: forming a first layer containing the specific element, nitrogen, and carbon on the substrate by alternately performing prescribed number of times: supplying a first source gas containing the specific element and a halogen-group to the substrate, and supplying a second source gas containing the specific element and an amino-group to the substrate, and forming a second layer by modifying the first layer by supplying a reactive gas different from each of the source gases, to the substrate. |
申请公布号 |
US9165761(B2) |
申请公布日期 |
2015.10.20 |
申请号 |
US201214240897 |
申请日期 |
2012.08.01 |
申请人 |
HITACHI KOKUSAI ELECTRIC INC. |
发明人 |
Hirose Yoshiro;Yamamoto Ryuji |
分类号 |
H01L21/31;H01L21/02;C23C16/36;C23C16/40;C23C16/455;H01L21/67;C23C16/30;C23C16/52 |
主分类号 |
H01L21/31 |
代理机构 |
Oliff PLC |
代理人 |
Oliff PLC |
主权项 |
1. A method for manufacturing a semiconductor device, comprising:
forming a thin film containing a specific element and having a prescribed composition on a substrate by performing a cycle of alternately performing n times, where n is an integer of one or more: forming a first layer containing the specific element, nitrogen, and carbon on the substrate by performing a set of alternately or simultaneously performing m times, where m is an integer of one or more:
supplying a first source gas containing the specific element and a halogen-group to the substrate, andsupplying a second source gas containing the specific element and an amino-group to the substrate; and forming a second layer by modifying the first layer by supplying a reactive gas different from each of the source gases, to the substrate. |
地址 |
Tokyo JP |