发明名称 Method for manufacturing semiconductor device, method for processing substrate, substrate processing apparatus and recording medium
摘要 There is provided a method for manufacturing a semiconductor device, including forming a thin film containing a specific element and having a prescribed composition on a substrate by alternately performing the following steps prescribed number of times: forming a first layer containing the specific element, nitrogen, and carbon on the substrate by alternately performing prescribed number of times: supplying a first source gas containing the specific element and a halogen-group to the substrate, and supplying a second source gas containing the specific element and an amino-group to the substrate, and forming a second layer by modifying the first layer by supplying a reactive gas different from each of the source gases, to the substrate.
申请公布号 US9165761(B2) 申请公布日期 2015.10.20
申请号 US201214240897 申请日期 2012.08.01
申请人 HITACHI KOKUSAI ELECTRIC INC. 发明人 Hirose Yoshiro;Yamamoto Ryuji
分类号 H01L21/31;H01L21/02;C23C16/36;C23C16/40;C23C16/455;H01L21/67;C23C16/30;C23C16/52 主分类号 H01L21/31
代理机构 Oliff PLC 代理人 Oliff PLC
主权项 1. A method for manufacturing a semiconductor device, comprising: forming a thin film containing a specific element and having a prescribed composition on a substrate by performing a cycle of alternately performing n times, where n is an integer of one or more: forming a first layer containing the specific element, nitrogen, and carbon on the substrate by performing a set of alternately or simultaneously performing m times, where m is an integer of one or more: supplying a first source gas containing the specific element and a halogen-group to the substrate, andsupplying a second source gas containing the specific element and an amino-group to the substrate; and forming a second layer by modifying the first layer by supplying a reactive gas different from each of the source gases, to the substrate.
地址 Tokyo JP