Flexible thermal ground plane and manufacturing the same

摘要

Methods, apparatuses, and systems are disclosed for flexible thermal ground planes. A flexible thermal ground plane may include a support member. The flexible thermal ground plane may include an evaporator region or multiple evaporator regions configured to couple with the support member. The flexible thermal ground plane may include a condenser region or multiple condenser regions configured to couple with the support member. The evaporator and condenser region may include a microwicking structure. The evaporator and condenser region may include a nanowicking structure coupled with the micro-wicking structure, where the nanowicking structure includes nanorods. The evaporator and condenser region may include a nanomesh coupled with the nanorods and/or the microwicking structure. Some embodiments may include a micromesh coupled with the nanorods and/or the microwicking structure.

主权项

1. A thermal ground plane comprising:
a first planar substrate member comprising a polymer layer; a second planar substrate member comprising a polymer layer and configured to enclose a working fluid in conjunction with the first planar substrate member, wherein the second planar substrate member and the first planar substrate member are hermetically sealed along more than two edges; an evaporator region disposed at least partially on at least one of the first planar substrate member and the second planar substrate member; a condenser region disposed at least partially on at least one of the first planar substrate member and the second planar substrate member; a liquid channel disposed between the condenser region and the evaporator region and between the first planar substrate member and the second planar substrate member; a vapor core disposed between the first planar substrate member and the second planar substrate member; and a mesh layer separating the liquid channel and the vapor core disposed between the first planar substrate member and the second planar substrate member, wherein the working fluid, in liquid form, flows through the liquid channel from the condenser region to the evaporator region without passing through the vapor core, wherein the evaporator region and the condenser region are separate and distinct regions located at a distance from each other, wherein the first planar member and the second planar member are flexible, wherein the thermal ground plane has a thickness less than 1 mm, and wherein the thermal ground plane has an in-plane thermal conductivity of greater than 500 W/mK where the evaporator region comprises a wicking structure, where the condenser region comprises another wicking structure, where the mesh layer is coupled to the wicking structure of the evaporator region and the wicking structure of the condenser region such that the mesh layer is spaced apart from the first and second planar substrate members to define the liquid channel.