发明名称 Spindle motor, disk drive apparatus, and electronic device
摘要 A spindle motor includes a base portion, a stationary portion, and a circuit substrate disposed in the base portion. The base portion includes a flat plate portion positioned below the rotary portion and a through-hole extending from an upper surface to a lower surface of the flat plate portion. The flat plate portion includes a first surface positioned between the upper surface and the lower surface of the flat plate portion and disposed within the through-hole. The circuit substrate includes a land portion to which a lead wire extending from a plurality of coils is electrically connected. The land portion is disposed on the first surface. The lead wire is connected to the land portion by solder within the through-hole.
申请公布号 US9166452(B1) 申请公布日期 2015.10.20
申请号 US201514640126 申请日期 2015.03.06
申请人 Nidec Corporation 发明人 Endo Takashi;Yawata Atsushi
分类号 G11B19/20;H02K3/28 主分类号 G11B19/20
代理机构 Keating & Bennett, LLP 代理人 Keating & Bennett, LLP
主权项 1. A spindle motor comprising: a stationary portion; and a rotary portion including a magnet, the rotary portion being configured to rotate about a center axis extending in an up and down direction; wherein the stationary portion includes a base portion, a stator including a plurality of coils and positioned above the base portion, and a circuit substrate disposed in the base portion; the base portion includes a flat plate portion positioned below the rotary portion and extending radially outward with respect to the center axis, and at least one through-hole extending from an upper surface to a lower surface of the flat plate portion; the flat plate portion includes a first surface positioned between the upper surface and the lower surface of the flat plate portion and disposed within the through-hole; the circuit substrate includes a land portion to which at least one lead wire extending from the plurality of coils is electrically connected; the land portion is disposed on the first surface; and the lead wire is connected to the land portion by solder within the through-hole.
地址 Kyoto JP