发明名称 |
Spindle motor, disk drive apparatus, and electronic device |
摘要 |
A spindle motor includes a base portion, a stationary portion, and a circuit substrate disposed in the base portion. The base portion includes a flat plate portion positioned below the rotary portion and a through-hole extending from an upper surface to a lower surface of the flat plate portion. The flat plate portion includes a first surface positioned between the upper surface and the lower surface of the flat plate portion and disposed within the through-hole. The circuit substrate includes a land portion to which a lead wire extending from a plurality of coils is electrically connected. The land portion is disposed on the first surface. The lead wire is connected to the land portion by solder within the through-hole. |
申请公布号 |
US9166452(B1) |
申请公布日期 |
2015.10.20 |
申请号 |
US201514640126 |
申请日期 |
2015.03.06 |
申请人 |
Nidec Corporation |
发明人 |
Endo Takashi;Yawata Atsushi |
分类号 |
G11B19/20;H02K3/28 |
主分类号 |
G11B19/20 |
代理机构 |
Keating & Bennett, LLP |
代理人 |
Keating & Bennett, LLP |
主权项 |
1. A spindle motor comprising:
a stationary portion; and a rotary portion including a magnet, the rotary portion being configured to rotate about a center axis extending in an up and down direction; wherein the stationary portion includes a base portion, a stator including a plurality of coils and positioned above the base portion, and a circuit substrate disposed in the base portion; the base portion includes a flat plate portion positioned below the rotary portion and extending radially outward with respect to the center axis, and at least one through-hole extending from an upper surface to a lower surface of the flat plate portion; the flat plate portion includes a first surface positioned between the upper surface and the lower surface of the flat plate portion and disposed within the through-hole; the circuit substrate includes a land portion to which at least one lead wire extending from the plurality of coils is electrically connected; the land portion is disposed on the first surface; and the lead wire is connected to the land portion by solder within the through-hole. |
地址 |
Kyoto JP |