| 发明名称 |
Partial glob-top encapsulation technique |
| 摘要 |
A electronic device includes: a circuit board; a semiconductor device, disposed on the circuit board; a cover material, disposed above the semiconductor device; a plurality of bonding wires, respectively connected between a plurality of first contact pads of the semiconductor device and a plurality of second contact pads of the circuit board; a first encapsulant, formed by a first material, arranged to encapsulate a plurality of second bonds formed by electrically connecting the bonding wires to the second contact pads; and a second encapsulant, formed by a second material that is different from the first material, arranged to encapsulate a plurality of first bonds formed by electrically connecting the bonding wires to the first contact pads. |
| 申请公布号 |
US9165794(B1) |
申请公布日期 |
2015.10.20 |
| 申请号 |
US201414447648 |
申请日期 |
2014.07.31 |
| 申请人 |
Himax Display, Inc. |
发明人 |
Tsai Jia-Lung |
| 分类号 |
H01L21/56;H01L23/31;H01L23/00 |
主分类号 |
H01L21/56 |
| 代理机构 |
|
代理人 |
Hsu Winston;Margo Scott |
| 主权项 |
1. An electronic device, comprising:
a circuit board; a semiconductor device, disposed on the circuit board; a cover material, disposed above the semiconductor device; a plurality of bonding wires, respectively connected between a plurality of first contact pads on the semiconductor device and a plurality of second contact pads on the circuit board; a first encapsulant, formed by a first material, arranged to encapsulate a section of each of the bonding wires and a plurality of second bonds that are formed by electrically connecting the bonding wires to the second contact pads; and a second encapsulant, formed by a second material that is different from the first material, arranged to encapsulate a plurality of first bonds that are formed by electrically connecting the bonding wires to the first contact pads, and being in contact with the plurality of first bonds. |
| 地址 |
Tainan TW |
