Method and apparatus for CMP conditioning

摘要

A polishing pad conditioning apparatus includes a laser beam generating unit for providing a laser beam, a fluid delivery system for providing a fluid stream and a vacuum line for removing debris. The laser beam may directly impinge on a surface of a polishing pad thereby creating cutting action, while an atomized fluid stream provides cooling and pad debris along with fluid are removed thru the vacuum line. Alternatively, the laser beam may be combined with the atomized fluid stream in a region above the pad surface to substantially impart part of its energy to the fluid stream, generating high energy droplets which provide “cool” cutting action on the pad surface.

主权项

1. A CMP conditioning apparatus comprising:
a polish table configured to support a CMP pad while polishing a wafer; and a laser beam generation unit disposed adjacent the polishing table, the laser beam generation unit configured to condition the CMP pad while on the polishing table, and while or between polishing wafers on the CMP pad.