Package structures including discrete antennas assembled on a device

摘要

Methods of forming a microelectronic packaging structure and associated structures formed thereby are described. Those methods and structures may include forming a package structure comprising a discrete antenna disposed on a back side of a device, wherein the discrete antenna comprises an antenna substrate, a through antenna substrate via vertically disposed through the antenna substrate. A through device substrate via that is vertically disposed within the device is coupled with the through antenna substrate via, and a package substrate is coupled with an active side of the device.

主权项

1. A method of forming a package structure comprising:
forming a discrete antenna on a back side of a device, wherein the discrete antenna comprises an antenna substrate; forming a through antenna substrate via through the antenna substrate, wherein the through antenna substrate via is vertically disposed through the antenna substrate; coupling the through antenna substrate via with a through substrate via that is vertically disposed within the device; and coupling the device with a package substrate.