Die structure, transfer molding apparatus, transfer molding method, optical member, area light source device, liquid crystal display device, and mobile device

摘要

A transfer molding method includes an insertion step of inserting a resin sheet between a first die and a second die, which are disposed opposite each other, a sandwiching step of sandwiching the resin sheet between the first and second dies while a transfer surface of a transfer member is brought into contact with at least one of surfaces of the resin sheet, and a transfer molding step of heating at least one of the first and second dies to melt at least a surface portion of the resin sheet with which the transfer surface of the transfer member is brought into contact, and exhausting residual air remaining in a recess through a groove portion connected to the recess when a thick portion is formed by the recess formed in the transfer surface.

主权项

1. A die structure comprising:
a first die; a second die configured to be separated from and brought into contact with the first die; and a transfer member disposed in at least one of the first and second dies, wherein the transfer member performs transfer molding while bringing a transfer surface into contact with a resin sheet supplied between the first and second dies, and wherein the transfer member includes a recess that is formed in the transfer surface and at least one groove portion that is connected to the recess, and wherein the at least one groove portion has a depth greater than or equal to that of the recess.