| 摘要 |
The present invention relates to a chemical mechanical wafer polishing apparatus. The apparatus comprises: a polishing pad; a polishing head; a drive unit; and a circular cross sectional membrane circumference wall unit, an edge chamber forming wall unit, and an internal chamber forming wall unit. The apparatus forms an edge chamber and an internal chamber. And, the apparatus has a membrane of an elastic material, an external support ring of a circular cross sectional shape, an internal support ring, and an air pressure adjusting unit. |
