| 摘要 |
The present invention relates to a composition for eliminating, from a substrate, organic or inorganic contaminant materials which is useful in the manufacturing of a semiconductor and an IT circuit board by using a copper metal. The present invention also relates to a cleaning liquid capable of effectively eliminating contaminant materials, which can be generated from a chemical mechanical polishing (CMP) and etching processes, in a process in which a copper metal wiring is applied without any damage to a copper and an insulating film. The cleaning liquid composition of the present invention comprises: based on a total weight percentage of the composition, 4 to 10 wt% of an amine compound; 1 to 10 wt% of a bubble stabilizer and an anti-re-adsorption agent for preventing reverse contamination; 0.1 to 2 wt% of a pH regulator; 0.1 to 2 wt% of a corrosion inhibitor; and deionized water for the remnants. The invention is able to eliminate contamination more effectively than a conventional copper cleaning liquid without any damage to a metal (Cu, Ti, Ta) and an insulating film (TiN, TaN, TEOS) exposed to a cleaning liquid in a copper-based circuit and therefore, it is possible to solve problems of a short circuit, a scratch on a metal surface which can be caused by an erroneous cleaning, and to improve an overall circuit yield. |
