发明名称 DOUBLE SIDE FLEXIBLE COPPER CLAD LAMINATE FOR FORMING FINE WIRING AND METHOD FOR MANUFACTURING THE SAME
摘要 The present invention relates to a double side flexible copper clad laminate for forming fine wiring and a method for manufacturing the same. The side flexible copper clad laminate forming fine wiring comprises: a flexible substrate; and an electroless copper plating layer individually formed on an upper portion of a front surface and a rear surface of the flexible substrate.
申请公布号 KR20150116583(A) 申请公布日期 2015.10.16
申请号 KR20140041615 申请日期 2014.04.08
申请人 FINE CHEM CO., LTD. 发明人 LEE, EUN HWA;JO, IN HYE
分类号 B32B15/08;B32B15/20;C23C18/16;C25D13/16;H05K1/03 主分类号 B32B15/08
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