发明名称 |
DOUBLE SIDE FLEXIBLE COPPER CLAD LAMINATE FOR FORMING FINE WIRING AND METHOD FOR MANUFACTURING THE SAME |
摘要 |
The present invention relates to a double side flexible copper clad laminate for forming fine wiring and a method for manufacturing the same. The side flexible copper clad laminate forming fine wiring comprises: a flexible substrate; and an electroless copper plating layer individually formed on an upper portion of a front surface and a rear surface of the flexible substrate. |
申请公布号 |
KR20150116583(A) |
申请公布日期 |
2015.10.16 |
申请号 |
KR20140041615 |
申请日期 |
2014.04.08 |
申请人 |
FINE CHEM CO., LTD. |
发明人 |
LEE, EUN HWA;JO, IN HYE |
分类号 |
B32B15/08;B32B15/20;C23C18/16;C25D13/16;H05K1/03 |
主分类号 |
B32B15/08 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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