电源模组用基板及其制造方法、电源模组;POWER MODULE SUBSTRATE, AND METHOD OF PRODUCING THE SAME; AND POWER MODULE

摘要

以连结Ag层(32)和在Ag层(32)之周围扩展之电路层之露出部分之方式，形成有细长的沟部(35)。沟部(35)系从Ag层(32)之表面贯通玻璃层(31)及铝氧化皮膜(12A)而到达至电路层(12)之表面(12a)的细长凹部。在沟部(35)形成有Ag层(32)之一部分沿着沟部(35)之内面(35a)而延展的延长部(36)。藉由延长部(36)，在沟部(35)之形成部分，Ag层(32)和电路层(12)系藉由电阻值低之Ag而直接被电性连接。; and a power module, are provided. In the power module substrate, the narrow groove (35) is formed in such a way that the narrow groove (35) connects the Ag layer (32) to the exposed portion of the circuit layer expanding around the Ag layer (32). The narrow groove (35) is a narrow recessed portion reaching to the surface (12a) of the circuit layer (12) from the surface of the Ag layer (32) penetrating through the glass layer (31) and the aluminum oxide coating film (12A). The extended portion (36), which is a part of Ag layer (32) extended along the inner surface (35a) of the groove (35), is formed in the narrow groove (35). The Ag layer (32) and the circuit layer (12) are electrically connected directly by the extended portion (36) in the groove-formed portion with low-electrical-resistance Ag.