在铜蚀刻溶液中藉由氧气和/或空气作为氧化剂进行铜之氧化;OXIDATION OF COPPER IN A COPPER ETCHING SOLUTION BY THE USE OF OXYGEN AND/OR AIR AS AN OXIDIZING AGENT

摘要

本发明系有关于一种在铜蚀刻溶液中藉由氧气和/或空气作为氧化剂进行铜的氧化之制程，本制程包括以下步骤：a)在含有氯离子(Cl - )和一价铜离子(Cu + )的酸性还原铜蚀刻溶液中加入氧化剂，b)搅拌在步骤a中所获得之溶液，使其发生下到反应：2 Cu + + O2(aq)+2 H + → 2 Cu 2+ +H2O从而产生比还原铜蚀刻溶液含有较少一价铜离子(Cu + )的氧化铜蚀刻溶液。本发明的一个优点是，它提供一种改进的制程，至少在氧化速度和蚀刻的品质方面更为优越。 The present invention relates to a process of oxidizing copper in a copper etching solution by using oxygen gas and/or air as an oxidizing agent, the process comprising the steps of: a) introducing the oxidizing agent into an acidic reduced copper etching solution comprising Cl - and Cu + , b) stirring the solution obtained in step a), and thereby allowing the reaction 2 Cu + + O2 (aq) + 2 H + →