| 摘要 |
According to an embodiment of the present invention, a heat management system for an electronic device includes a heat frame, a conformal slot portion, a chassis frame and a heat fin. The heat frame, the conformal slot, the chassis frame and the heat fin are formed integrally as a unitary structure integrated by additive manufacturing. According to another embodiment of the present invention, a modular vapor assembly has a vapor channel comprising one component surface, a top surface and at least one liquid receptacle formed between the component surface and the top surface, and has a wick structure on at least a part in the component surface. Regarding operation, a circuit card comprises at least a part of electronic components connected to the component surface of a vapor chamber, and the wick structures send out at least a part of a liquid to the electronic components, and the liquid is changed into vapor moving to a storage tank. |
