发明名称 LASER LIFT-OFF APPARATUS
摘要 Provided is a laser lift-off apparatus with a structure for preventing an issue generated by a protruding member from a work involving a lift-off for a small work. In the present invention: a support substrate (S2) with a chip-shaped work (W) attached, which is made of a sapphire substrate (S1) and a material layer (M), is put on a work stage (4); and, a laser beam from a laser source (1) is irradiated by a projecting lens (2) through a mask (21) to the chip-shaped work (W). The arrived position of the sapphire substrate (S1) coming from the chip-shaped work (W) in case of a lift-off is regulated by an arrived position regulating member. Accordingly, issues due to the arrival of the sapphire substrate (S1) are prevented.
申请公布号 KR20150116778(A) 申请公布日期 2015.10.16
申请号 KR20150044185 申请日期 2015.03.30
申请人 USHIO DENKI KABUSHIKI KAISHA 发明人 NARUMI KEIJI
分类号 H01L21/78;H01L21/268;H01L33/00 主分类号 H01L21/78
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