| 摘要 |
The invention relates to a method for inspecting wafers or other flat objects 40), comprising the following steps: producing a relative motion of a camera assembly (10, 20) having a digital camera and the object, during which relative motion a part of the object surface is sensed by the camera at a recording time period; illuminating the object; and recording one or more images of at least one part of the object surface by means of the camera in a camera assembly. Said method is characterized in that the object is continuously illuminated, the illumination intensity is controlled to a constant value, the relation motion between the camera assembly and the object occurs continuously and without interruption, and the exposure duration during the recording of the image is limited by means of a shutter to an exposure duration that is less than the time in which the motion blurring of the image resulting from the relative motion is not greater than permissible for the image evaluation. |
