| 摘要 |
The present invention relates to a substrate treating apparatus. The substrate treating apparatus according to an embodiment of the present invention includes a housing having an opening through which a substrate enters or exits, a gas supply unit supplying a gas into the housing to increase a pressure inside the housing, a sensor unit measuring the pressure inside the housing, a door opening or closing the opening, a controller controlling driving of the door. The controller carries out a first substrate from the housing if the door is opened, and at the same time, sets a pressure measured by the sensor unit as a reference value. The controller controls the sensor unit to measure a pressure after a certain processing of a second substrate in the housing is completed, and compares the measurement with the reference value to determine whether to open the door. |
