| 发明名称 |
MEMS MOTORS HAVING INSULATED SUBSTRATES |
| 摘要 |
A microelectromechanical system (MEMS) die includes a substrate, an insulation layer disposed adjacent to the substrate, a diaphragm connected to the insulation layer, and a back plate connected to the insulation layer. The back plate is disposed in spaced relation to the diaphragm. The insulation layer is positioned between the substrate and the diaphragm and back plate to electrically isolate the substrate from the diaphragm and the back plate. |
| 申请公布号 |
US2015296306(A1) |
申请公布日期 |
2015.10.15 |
| 申请号 |
US201514669766 |
申请日期 |
2015.03.26 |
| 申请人 |
Knowles Electronics, LLC. |
发明人 |
Shao Ning;Lautenschlager Eric J. |
| 分类号 |
H04R23/00 |
主分类号 |
H04R23/00 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A microelectromechanical system (MEMS) die comprising:
a substrate; an insulation layer disposed adjacent to the substrate; a diaphragm connected to the insulation layer; and a back plate connected to the insulation layer, the back plate disposed in spaced relation to the diaphragm; wherein the insulation layer is positioned between the substrate and the diaphragm, and between the substrate and the back plate to electrically isolate the substrate from the diaphragm and the back plate. |
| 地址 |
Itasca IL US |
