| 发明名称 |
OPTICALLY INTERCONNECTED CHIP, METHOD OF TESTING THE SAME, AND OPTICAL RECEIVER |
| 摘要 |
An optically interconnected chip includes a first optical transmitter circuit, a first spot size converter connected by a first optical waveguide to the first optical transmitter circuit, a first optical receiver circuit, a second spot size converter connected by a second optical waveguide to the first optical receiver circuit, a rotator provided between the second spot size converter and the first optical receiver circuit and configured to rotate a direction of polarization of light propagating through the second optical waveguide by 45 degrees, and a splitter provided after the rotator and configured to separate the rotated light into components according to directions of polarization of the light, wherein the first spot size converter and the second spot size converter are coupled directly to each other on a wafer. |
| 申请公布号 |
US2015295675(A1) |
申请公布日期 |
2015.10.15 |
| 申请号 |
US201514750505 |
申请日期 |
2015.06.25 |
| 申请人 |
FUJITSU LIMITED |
发明人 |
Sugama Akio |
| 分类号 |
H04J14/06;H04B10/40;H04B10/25 |
主分类号 |
H04J14/06 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. An optically interconnected chip comprising:
a first optical transmitter circuit; a first spot size converter connected by a first optical waveguide to the first optical transmitter circuit; a first optical receiver circuit; a second spot size converter connected by a second optical waveguide to the first optical receiver circuit; a rotator provided between the second spot size converter and the first optical receiver circuit and configured to rotate a direction of polarization of light propagating through the second optical waveguide by 45 degrees; and a splitter provided after the rotator and configured to separate the rotated light into components according to directions of polarization of the light, wherein the first spot size converter and the second spot size converter are coupled directly to each other on a wafer. |
| 地址 |
Kawasaki-shi JP |
