SYSTEMS AND METHODS FOR REINFORCED ADHESIVE BONDING

摘要

A bonding system comprising a first substrate, a first substrate (110) having a first contact surface (115) including a plurality of grooves (140), a second substrate (120) having a second contact surface (125), an adhesive (200) in contact with the first contact surface (115), and the second contact surface (125), and a plurality of solder balls (300) positioned at least partially in the adhesive (200) and in contact with the first contact surface (115). A bonding method comprising applying, on a first contact surface (115) including a plurality of grooves (140) an adhesive (200), positioning,at least partially in the adhesive (200), each of a plurality of solder balls (300), connecting, to a portion of the adhesive (200)opposite the first contact surface (115), a second contact surface (125), and applying heat to the first contact surface (115) such that at least one of the plurality of solder balls (300) reaches a solder-ball bonding temperature whereat the solder ball bonds to the first contact surface (115).