| 摘要 |
PROBLEM TO BE SOLVED: To provide a liquid epoxy resin composition in which an impregnation property to a narrow gap is excellent, and precipitation of a filler and generation of void are rare; and an electronic part device of a high formability and a high reliability in which flip chip packaging is performed so that a circuit formation face of an element such as a semi-conductor may face a circuit formation face of a substrate through a bump, and an aperture between the element and the substrate is charged with the resin composition.SOLUTION: A liquid epoxy resin composition for used is a solventless liquid epoxy resin composition that includes: (A) an epoxide resin; (B) a hardener; and (C) an inorganic filler as essential components, includes (D) a hardening accelerator as required, is that a viscosity ratio &eegr;/&eegr;or a thixotropic exponent measured by numbers of revolution nand n(n/n<0.5) of a rotational viscometer is smaller than 0.8. |
