| 摘要 |
<p>THE DETACHMENT AND REMOVAL OF A SEMICONDUCTOR CHIP (1) FROM A FOIL (3) OCCURS IN ACCORDANCE WITH THE INVENTION IN THREE PHASES. IN THE FIRST PHASE THERE IS A PARTIAL DETACHMENT OF THE SEMICONDUCTOR CHIP (1) FROM THE FOIL (3) WITH MECHANICAL MEANS, BUT WITHOUT THE PARTICIPATION OF A CHIP GRIPPER (11). IN THE SECOND PHASE THE SEMICONDUCTOR CHIP (1) IS FURTHER DETACHED FROM THE FOIL (3), WITH THE SEMICONDUCTOR CHIP (1) BEING HELD BY THE CHIP GRIPPER (11). IN THE THIRD PHASE THE CHIP GRIPPER (11) IS LIFTED AND MOVED AWAY. (FIG. 1B)</p> |
