SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE

摘要

An SGT is produced by forming a first insulating film around a fin-shaped semiconductor layer, forming a pillar-shaped semiconductor layer in an upper portion of the fin-shaped layer, forming a second insulating film, a polysilicon gate electrode covering the second insulating film, and a polysilicon gate line, forming a diffusion layer in an upper portion of the fin-shaped layer and a lower portion of the pillar-shaped layer, forming a metal-semiconductor compound in an upper portion of the diffusion layer in the fin-shaped layer, depositing an interlayer insulating film, exposing and etching the polysilicon gate electrode and gate line, depositing a first metal, forming a metal gate electrode and a metal gate line, and forming a third metal sidewall on an upper side wall of the pillar-shaped layer. The third metal sidewall is connected to an upper surface of the pillar-shaped layer.

主权项

1. A method for producing a semiconductor device, comprising:
a first step of forming a fin-shaped semiconductor layer on a semiconductor substrate, forming a first insulating film around the fin-shaped semiconductor layer, and forming a pillar-shaped semiconductor layer in an upper portion of the fin-shaped semiconductor layer; a second step of, after the first step, forming a second insulating film, a polysilicon gate electrode, and a polysilicon gate line, the second insulating film covering a periphery and an upper portion of the pillar-shaped semiconductor layer, the polysilicon gate electrode covering the second insulating film; a third step of, after the second step, forming a diffusion layer in an upper portion of the fin-shaped semiconductor layer and a lower portion of the pillar-shaped semiconductor layer; a fourth step of, after the third step, forming a metal-semiconductor compound in an upper portion of the diffusion layer formed in the upper portion of the fin-shaped semiconductor layer; a fifth step of, after the fourth step, depositing an interlayer insulating film, exposing the polysilicon gate electrode and the polysilicon gate line, etching the polysilicon gate electrode and the polysilicon gate line, subsequently depositing a first metal, and forming a metal gate electrode and a metal gate line; and a sixth step of, after the fifth step, forming a sidewall composed of a third metal on an upper side wall of the pillar-shaped semiconductor layer, wherein the sidewall composed of the third metal is connected to an upper surface of the pillar-shaped semiconductor layer.