发明名称 MIM CAPACITOR STRUCTURE
摘要 The present disclosure relates to a MIM capacitor, and an associated method of formation. In some embodiments, the MIM capacitor has a first electrode having a bottom capacitor metal layer disposed over a semiconductor substrate. A second electrode having a middle capacitor metal layer overlies the bottom capacitor metal layer. A third electrode having a top capacitor metal layer has a stepped structure is laterally and vertically separated from the middle capacitor metal layer by a capacitor dielectric layer continuously extends from a first position between the bottom capacitor metal layer and the middle capacitor metal layer, to a second position between the middle capacitor metal layer and the top capacitor metal layer. The capacitor dielectric layer allows for the MIM capacitor to have a structure that improves fabrication of the capacitor.
申请公布号 US2015295019(A1) 申请公布日期 2015.10.15
申请号 US201414249482 申请日期 2014.04.10
申请人 Taiwan Semiconductor Manufacturing Co., Ltd. 发明人 Wang Chien-Chung;Tseng Wei-Min;Shen Shih-Guo;Chu Huey-Chi;Chiang Wen-Chuan
分类号 H01L49/02;H01L21/28;H01L21/02;H01L21/768;H01L23/58 主分类号 H01L49/02
代理机构 代理人
主权项 1. A MIM (metal-insulator-metal) capacitor, comprising: a first electrode comprising a bottom capacitor metal layer disposed over a semiconductor substrate; a second electrode comprising a middle capacitor metal layer overlying the bottom capacitor metal layer; and a third electrode comprising a top capacitor metal layer comprising a stepped structure that is vertically and laterally separated from the middle capacitor metal layer by a capacitor dielectric layer that continuously extends from a first position between the bottom capacitor metal layer and the middle capacitor metal layer, to a second position between the middle capacitor metal layer and the top capacitor metal layer.
地址 Hsin-Chu TW