发明名称 MULTILAYER ELECTRONIC COMPONENT
摘要 A multilayer electronic component includes a ceramic body including a plurality of insulating layers; an internal coil part in which a plurality of first internal coil patterns and a plurality of second internal coil patterns disposed on the insulating layers are connected to each other; and a first external electrode connected to first lead parts of the first and second internal coil patterns, and a second external electrode connected to second lead parts of the first and second internal coil patterns, wherein the first and second internal coil patterns are disposed on the insulating layers adjacent to each other and are connected to each other in parallel, and the via electrodes are disposed such that a plurality of via electrodes configure a single connection terminal.
申请公布号 US2015294779(A1) 申请公布日期 2015.10.15
申请号 US201414322595 申请日期 2014.07.02
申请人 SAMSUNG ELECTRO-MECHANICS CO., LTD. 发明人 LIM Bong Sup
分类号 H01F27/28;H01F27/29 主分类号 H01F27/28
代理机构 代理人
主权项 1. A multilayer electronic component comprising: a ceramic body including a plurality of insulating layers; an internal coil part in which a plurality of first internal coil patterns and a plurality of second internal coil patterns disposed on the plurality of insulating layers are connected to each other by via electrodes penetrating through the insulating layers; and a first external electrode disposed on at least one surface of the ceramic body and connected to first lead parts of the first and second internal coil patterns, and a second external electrode disposed on at least one surface of the ceramic body and connected to second lead parts of the first and second internal coil patterns, wherein the first and second internal coil patterns are disposed on the insulating layers adjacent to each other, the first and second internal coil patterns are connected to each other in parallel, and the via electrodes are disposed such that a plurality of the via electrodes configure a single connection terminal.
地址 Suwon-Si KR