| 摘要 |
PROBLEM TO BE SOLVED: To provide a reliable thermal flowmeter in which a fixation part for holding and fixing a circuit package to a housing reduces a stress applied to the circuit package.SOLUTION: In a first resin molding process, a circuit package 400 including a flow rate detection circuit is molded. In a second resin molding process, a fixation part 3721 is molded together with a housing 302, and the circuit package 400 is held and fixed to the housing 302 by making the circuit package 400 incorporated by the fixation part 3721. The fixation part 3721 is composed of a thick wall part 4714 and a thin wall part 4710 in order to reduce an influence of a stress generated on the basis of a temperature change of the fixation part 3721 upon the circuit package 400. Because the thickness of resin is thin in the thin wall part 4710, the generated stress is small. Thus, force applied to the circuit package 400 can be reduced. |
