发明名称 |
CHIP PACKAGING STRUCTURE AND PACKAGING METHOD |
摘要 |
A chip packaging structure and packaging method. The packaging structure comprises: a semiconductor substrate; a metal pad provided inside the semiconductor substrate; an insulating layer provided on the semiconductor substrate, the insulating layer having an opening for exposing the metal pad; a sub-ball metal electrode provided on the metal pad; a solder ball provided on the surface of the sub-ball metal electrode, the solder ball having a first apron structure and the first apron structure covering partial metal pad on the periphery of the bottom of the under-ball metal electrode. The chip packaging structure of the present invention enhances the adhesion between the solder ball and the metal pad, and improves the reliability in chip packaging. |
申请公布号 |
US2015294949(A1) |
申请公布日期 |
2015.10.15 |
申请号 |
US201314441477 |
申请日期 |
2013.10.30 |
申请人 |
NANTONG FUJITSU MICROELECTRONICS CO., LTD. |
发明人 |
Lin Chang-Ming;Shi Lei;Shen Haijun |
分类号 |
H01L23/00 |
主分类号 |
H01L23/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
Jiangsu CN |