发明名称 THERMAL EXPANSION RESIN COMPOSITION
摘要 A thermally expandable resin composition containing an epoxy resin, a thermally expandable graphite, and an inorganic filler excluding graphite. The epoxy resin contains a bisphenol-type epoxy compound and an aliphatic epoxy compound, wherein the weight ratio of the bisphenol-type epoxy compound to the aliphatic epoxy compound is in the range 95:5-60:40.
申请公布号 US2015291773(A1) 申请公布日期 2015.10.15
申请号 US201314434201 申请日期 2013.10.10
申请人 SEKISUI CHEMICAL CO., LTD. 发明人 Yoshitake Toshitaka;Tono Masaki;Otsuka Kenji;Yano Hideaki
分类号 C08K5/3492;C08K3/32;C08K3/26;C08K3/04;C08K3/22 主分类号 C08K5/3492
代理机构 代理人
主权项 1. A thermally expandable resin composition which contains an epoxy resin, a thermally expandable graphite and an inorganic filler, said inorganic filler excluding graphite, said thermally expandable resin composition being adapted for use in refractory coating materials for pillars, beams and walls, and fireproof sashes, and fireproof compartment passage structures and in fireproof doors, and said epoxy resin containing an epoxy compound containing a bisphenol-type epoxy compound represented bywherein R1 and R2 are each independently a hydrogen atom or a methyl group, R3-R6 are each independently any one of a hydrogen atom or a methyl group, Z is a repeating unit ranging from 1 to-1-00-) 100, and an aliphatic epoxy compound represented bywherein R is an alkylene group having 1 to 500 carbon atoms, and can contain an oxygen atom. n is a repeating unit ranging from 2 to 4, m is a repeating unit ranging from 0 to 1 and n+m is the range of 2-4, and the ratio of a bisphenol-type epoxy compound to an aliphatic epoxy compound ranges from 95:5 to 65:35 in weight.
地址 Osaka-shi, Osaka JP