| 发明名称 |
CROSSLINKED FLUOROPOLYMER CIRCUIT MATERIALS, CIRCUIT LAMINATES, AND METHODS OF MANUFACTURE THEREOF |
| 摘要 |
Circuit subassemblies 10 comprising a conductive layer 12 disposed on a dielectric substrate layer 14, wherein the dielectric substrate layer comprises a crosslinked fluoropolymer. |
| 申请公布号 |
WO2015157216(A1) |
申请公布日期 |
2015.10.15 |
| 申请号 |
WO2015US24622 |
申请日期 |
2015.04.07 |
| 申请人 |
ROGERS CORPORATION |
发明人 |
WILLIAMS, SHAWN PAUL;BOISVERT, RONALD PAUL |
| 分类号 |
H05K3/02;B32B15/08;H05K1/03;H05K3/46 |
主分类号 |
H05K3/02 |
| 代理机构 |
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代理人 |
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