| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method of a package substrate for mounting an optical semiconductor element which enables improvement of the productivity by reduction in the lead time, the number of members to be used, and processes and achieves low costs, and to provide a manufacturing method of an optical semiconductor device which uses the manufacturing method of the package substrate for mounting the optical semiconductor element.SOLUTION: A package substrate 430 for mounting an optical semiconductor element has a light reflection thermosetting resin composition layer 421, on which two or more recessed parts 420 serving as optical semiconductor element mounting regions are formed, on a wiring board 400. In a manufacturing method of the package substrate 430, the light reflection thermosetting resin composition layer 421 is formed by transfer molding. |
