发明名称 WIRING BOARD AND MOUNTING STRUCTURE INCLUDING THE SAME
摘要 According to an aspect of the invention, a wiring board includes an inorganic insulating layer and a conductive layer disposed on part of one main surface of the inorganic insulating layer. The part of the one main surface of the inorganic insulating layer includes a plurality of first recessed portions each of which has at least partially circular shape in a plan view. Part of the conductive layer enters into the plurality of first recessed portions. According to the aspect of the invention, it is possible to obtain a wiring board capable of reducing disconnection of the conductive layer and therefore having superior electrical reliability.
申请公布号 US2015296613(A1) 申请公布日期 2015.10.15
申请号 US201314646065 申请日期 2013.11.13
申请人 KYOCERA CORPORATION 发明人 Matsui Takeshi;Hayashi Katsura
分类号 H05K1/03;H05K1/11;H05K1/18;H05K1/02 主分类号 H05K1/03
代理机构 代理人
主权项 1. A wiring board, comprising: an inorganic insulating layer; and a conductive layer disposed on part of one main surface of the inorganic insulating layer, the part of the one main surface of the inorganic insulating layer including a plurality of first recessed portions each of which has at least partially circular shape in a plan view, part of the conductive layer entering into the plurality of first recessed portions.
地址 Kyoto-shi, Kyoto JP