发明名称 |
WIRING BOARD AND MOUNTING STRUCTURE INCLUDING THE SAME |
摘要 |
According to an aspect of the invention, a wiring board includes an inorganic insulating layer and a conductive layer disposed on part of one main surface of the inorganic insulating layer. The part of the one main surface of the inorganic insulating layer includes a plurality of first recessed portions each of which has at least partially circular shape in a plan view. Part of the conductive layer enters into the plurality of first recessed portions. According to the aspect of the invention, it is possible to obtain a wiring board capable of reducing disconnection of the conductive layer and therefore having superior electrical reliability. |
申请公布号 |
US2015296613(A1) |
申请公布日期 |
2015.10.15 |
申请号 |
US201314646065 |
申请日期 |
2013.11.13 |
申请人 |
KYOCERA CORPORATION |
发明人 |
Matsui Takeshi;Hayashi Katsura |
分类号 |
H05K1/03;H05K1/11;H05K1/18;H05K1/02 |
主分类号 |
H05K1/03 |
代理机构 |
|
代理人 |
|
主权项 |
1. A wiring board, comprising:
an inorganic insulating layer; and a conductive layer disposed on part of one main surface of the inorganic insulating layer, the part of the one main surface of the inorganic insulating layer including a plurality of first recessed portions each of which has at least partially circular shape in a plan view, part of the conductive layer entering into the plurality of first recessed portions. |
地址 |
Kyoto-shi, Kyoto JP |