发明名称 |
LED PACKAGE STRUCTURE |
摘要 |
An LED package structure includes: an insulating substrate that has a front bonding pad assembly; a dark-colored die-attach adhesive; blue and green LED chips mounted on the front bonding pad assembly via the dark-colored die-attach adhesive; and a dark-colored and light-transmissible encapsulant that is disposed on the insulating substrate and that encapsulates the blue and green LED chips. The encapsulant has a light transmittance that ranges from 7% to 28% for the blue light and has a light transmittance that ranges from 9% to 30% for the green light. |
申请公布号 |
US2015294959(A1) |
申请公布日期 |
2015.10.15 |
申请号 |
US201514590263 |
申请日期 |
2015.01.06 |
申请人 |
LITE-ON OPTO TECHNOLOGY (CHANGZHOU) CO., LTD. ;LITE-ON TECHNOLOGY CORP. |
发明人 |
LEE HOU-TE;YING TSUNG-KANG;HSU ERH-CHAN |
分类号 |
H01L25/075;H01L33/62;H01L33/58;H01L33/48;H01L33/54 |
主分类号 |
H01L25/075 |
代理机构 |
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代理人 |
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主权项 |
1. An LED package structure, comprising:
an insulating substrate that has a front bonding pad assembly formed thereon; a dark-colored die-attach adhesive; a blue LED chip emitting a blue light and being mounted on said front bonding pad assembly via said dark-colored die-attach adhesive; a green LED chip emitting a green light and being mounted on said front bonding pad assembly via said dark-colored die-attach adhesive; and a dark-colored and light-transmissible encapsulant that is disposed on said insulating substrate and that encapsulates said blue LED chip and said green LED chip, said encapsulant having a light transmittance that ranges from 7% to 28% for said blue light and having a light transmittance that ranges from 9% to 30% for said green light. |
地址 |
JIANGSU PROVINCE CN |