| 摘要 |
[OBJECTS] A GOLD-PLATINUM-PALLADIUM ALLOY BONDING WIRE IS PROPOSED FOR USE WITH SEMICONDUCTOR DEVICES FOR AUTOMOTIVE VEHICLES, WHICH EXHIBITS EXCELLENT CONNECTION PERFORMANCE RELIABILITY WHEN CONNECTED TO AN ALUMINUM PAD SUCH THAT EVEN IN A CASE WHEREIN AN EPOXY RESIN FREE OF HALOGEN ELEMENTS IS USED, THE DURABILITY THROUGHOUT HIGH TEMPERATURE EXPOSURE AND THE CAPABILITY OF PRESERVING ELECTRIC PROPERTIES DESPITE HIGH TEMPERATURE EXPOSURE ARE EXCELLENT. [MEANS FOR SOLUTION] A GOLD-PLATINUM-PALLADIUM ALLOY BONDING WIRE COMPOSED OF PLATINUM BY 0.4 - 1.2 MASS %, PALLADIUM BY 0.01 - 0.5 MASS %, ALUMINUM BY 10 - 30 MASS PPM, AT LEAST ONE OF CALCIUM AND MAGNESIUM BY 10 - 60 MASS PPM IN SUM, AND A BALANCE, WHICH IS GOLD OF A PURITY OF 99.999 MASS % OR GREATER. NO |
