| 发明名称 |
INTERPOSER FRAME WITH POLYMER MATRIX AND METHODS OF FABRICATION |
| 摘要 |
An array of chip sockets defined by an organic matrix framework surrounding sockets through the organic matrix framework and further comprising a grid of metal vias through the organic matrix framework. In an embodiment, a panel includes an array of chip sockets, each surrounded and defined by an organic matrix framework including a grid of copper vias through the organic matrix framework. The panel includes at least a first region with sockets having a set of dimensions for receiving one type of chip and a second region with sockets and another set of dimensions for receiving a second type of chip. |
| 申请公布号 |
US2015296617(A1) |
申请公布日期 |
2015.10.15 |
| 申请号 |
US201414269884 |
申请日期 |
2014.05.05 |
| 申请人 |
Zhuhai Advanced Chip Carriers & Electronic Substrate Solutions Technologies Co. Ltd. |
发明人 |
Hurwitz Dror;Huang Alex |
| 分类号 |
H05K1/11;H05K3/06;C25D5/02;H05K1/03;H05K3/00 |
主分类号 |
H05K1/11 |
| 代理机构 |
|
代理人 |
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| 主权项 |
1. An array of chip sockets defined by an organic matrix framework surrounding sockets through the organic matrix framework and further comprising a grid of metal vias through the organic matrix framework. |
| 地址 |
Zhuhai CN |
