发明名称 INTERGRATED CHIP MOUNTER
摘要 In the present invention, disclosed is an integrated component mounter. The integrated component mounter according to the present invention has a configuration to make a head and a component supply module into a single module. Therefore, the present invention remarkably reduces the number of which a head, which is a unit to mount a component, reciprocates between a component mounting region and a component supply region.
申请公布号 KR20150116271(A) 申请公布日期 2015.10.15
申请号 KR20140041292 申请日期 2014.04.07
申请人 SAMSUNG TECHWIN CO., LTD. 发明人 KIM, TAE IL
分类号 H05K13/04;H05K13/02 主分类号 H05K13/04
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