| 摘要 |
<p>AN OBJECT OF THE PRESENT INVENTION IS TO ENABLE FORMATION OF A RESIN LAYER WHICH REDUCES THE THICKNESS OF A MULTILAYERED FLEXIBLE PRINTED WIRING BOARD WITHOUT CAUSING PROBLEMS IN THE PROCESS OF MULTILAYER FORMING, AND IS EXCELLENT IN FLEXIBILITY. TO ACHIEVE THE OBJECT, A RESIN COMPOUND FOR FORMING AN ADHESIVE LAYER OF A MULTILAYERED FLEXIBLE PRINTED WIRING BOARD WHICH IS USED FOR FORMATION OF AN ADHESIVE LAYER FOR BONDING AN OUTER LAYER OF A PRINTED WIRING BOARD ONTO A SURFACE OF AN INNER LAYER FLEXIBLE PRINTED WIRING BOARD, THE RESIN COMPOUND IS MADE TO COMPRISE COMPONENTS A (AN EPOXY RESIN COMPOSED OF ONE OR MORE SELECTED FROM THE GROUP CONSISTING OF BISPHENOL EPOXY RESINS OF WHICH EPOXY EQUIVALENTS ARE 200 OR LESS AND ARE LIQUID AT ROOM TEMPERATURE), B (AN EPOXY RESIN PERFORMING HIGH THERMAL RESISTANCE), C (A PHOSPHORUS-CONTAINING FLAME-RETARDANT EPOXY RESIN), D (A RUBBER-MODIFIED POLYAMIDE-IMIDE RESIN, THE RESIN HAVING THE PROPERTY OF BEING SOLUBLE IN A SOLVENT HAVING A BOILING POINT IN THE RANGE OF 50 TO 200°C), AND E (A RESIN CURING AGENT COMPOSED OF ONE OR MORE SELECTED FROM THE GROUP CONSISTING OF BIPHENYL TYPE PHENOL RESIN AND A PHENOL ARALKYL TYPE PHENOL RESIN) AND A RESIN-COATED COPPER FOIL AND THE LIKE IN WHICH THE RESIN LAYER IS FORMED BY USING THE RESIN COMPOUND IS USED.</p> |
