发明名称 |
RRAM Cell with Bottom Electrode |
摘要 |
The present disclosure relates to a resistive random access memory (RRAM) cell having a bottom electrode that provides for low leakage currents within the RRAM cell without using insulating sidewall spacers, and an associated method of formation. In some embodiments, the RRAM cell has a bottom electrode disposed over a lower metal interconnect layer surrounded by a lower inter-level dielectric (ILD) layer. A bottom dielectric layer is disposed over the lower metal interconnect layer and/or the lower ILD layer. A dielectric data storage layer having a variable resistance is located above the bottom dielectric layer and the bottom electrode, and a top electrode is disposed over the dielectric data storage layer. Placement of the dielectric data storage layer onto the bottom dielectric layer increases a leakage path distance between the bottom and top electrodes, and thereby provides for low leakage current for the RRAM cell. |
申请公布号 |
US2015295172(A1) |
申请公布日期 |
2015.10.15 |
申请号 |
US201414252111 |
申请日期 |
2014.04.14 |
申请人 |
Taiwan Semiconductor Manufacturing Co., Ltd. |
发明人 |
Sung Fu-Ting;Liu Shih-Chang;Tsai Chia-Shiung;Liao Yu-Wen;Chu Wen-Ting;Chang Yu-Hsing;Lee Ru-Liang |
分类号 |
H01L45/00;H01L23/538 |
主分类号 |
H01L45/00 |
代理机构 |
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代理人 |
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主权项 |
1. A resistive random access memory (RRAM) cell, comprising:
a bottom electrode disposed over a lower metal interconnect layer surrounded by a lower inter-level dielectric (ILD) layer; a bottom dielectric layer disposed over the lower metal interconnect layer or the lower ILD layer; a dielectric data storage layer having a variable resistance, wherein a bottom surface of the dielectric data storage layer abuts top surfaces of the bottom dielectric layer and the bottom electrode; and a top electrode disposed over the dielectric data storage layer. |
地址 |
Hsin-Chu TW |