发明名称 |
ELECTRONIC DEVICE HAVING A TERMINATION REGION INCLUDING AN INSULATING REGION |
摘要 |
An electronic device can include an electronic component and a termination region adjacent to the electronic component region. In an embodiment, the termination region can include an insulating region that extends a depth into a semiconductor layer, wherein the depth is less than 50% of the thickness of the semiconductor layer. In another embodiment, the termination region can include a first insulating region that extends a first depth into the semiconductor layer, and a second insulating region that extends a second depth into the semiconductor layer, wherein the second depth is less than the first depth. In another aspect, a process of forming an electronic device can include patterning a semiconductor layer to define a trench within termination region while another trench is being formed for an electronic component within an electronic component region. |
申请公布号 |
US2015295025(A1) |
申请公布日期 |
2015.10.15 |
申请号 |
US201414249677 |
申请日期 |
2014.04.10 |
申请人 |
Semiconductor Components Industries, LLC |
发明人 |
ROIG GUITART Jaume;HOSSAIN Zia;MOENS Peter |
分类号 |
H01L29/06;H01L29/40 |
主分类号 |
H01L29/06 |
代理机构 |
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代理人 |
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主权项 |
1. An electronic device comprising:
an electronic component region; and a termination region adjacent to the electronic component region and including:
a substrate;a vertical region overlying the substrate;a semiconductor layer having a thickness, a primary surface and an opposite surface, wherein:
the semiconductor layer overlies the substrate; andthe substrate is closer to the opposite surface than the primary surface; andan insulating region that extends a depth into the semiconductor layer, wherein the depth is less than 50% of the thickness of the semiconductor layer. |
地址 |
Phoenix AZ US |