| 摘要 |
A microelectromechanical system (MEMS) die includes a substrate, an insulation layer disposed adjacent to the substrate, a diaphragm connected to the insulation layer, and a back plate connected to the insulation layer. The back plate is disposed in spaced relation to the diaphragm. The insulation layer is positioned between the substrate and the diaphragm and back plate to electrically isolate the substrate from the diaphragm and the back plate. |
