SOLVENT-SOLUBLE POLYIMIDE RESIN

摘要

PROBLEM TO BE SOLVED: To provide a solvent-soluble polyimide resin capable of forming an adhesive layer which does not generate a volatile component formed of a cyclic siloxane compound and does not lower an adhesive force between a wiring layer and a coverlay film even in the use environment exposed to a high temperature repeatedly.SOLUTION: A solvent-soluble polyimide resin is obtained by reacting an acid anhydride component which has a weight average molecular weight of 10,000-200,000 and includes an aromatic tetracarboxylic acid anhydride with a diamine component including aliphatic diamine. The diamine component which is a raw material of the solvent-soluble polyimide resin includes aliphatic diamine derived from a dimer acid having 24-48 carbon atoms, and may further include aromatic diamine. The solvent-soluble polyimide resin preferably does not include a siloxane compound as a raw material.