LIGHT-EMITTING DIODE PACKAGE

摘要

The present invention relates to a light-emitting diode package. According to the present invention, a light-emitting diode package comprises: a substrate for growth; a passivation layer formed on a surface of one side of the substrate for growth; and a package substrate having a main body portion and a wall portion, wherein the wall portion is formed on the main body portion. At least the space formed among the main body portion, the wall portion and the passivation layer is sealed from the outside.

主权项

1. A light emitting diode package comprising:
a growth substrate; a passivation layer disposed on one surface of the growth substrate; and a package substrate comprising a body section and a wall section disposed on the body section, wherein at least a space between the body section, the wall section and the passivation layer is sealed from outside, and wherein the body section of the package substrate is integrally formed with the wall section thereof.