| 摘要 |
Disclosed in the present invention is a manifold assembly for an injection molding machine. A band heater for a manifold resin guiding pipe of the present invention receives a molten resin from an injection cylinder, and divides and supplies the molten resin to multiple nozzles. The manifold assembly heated by a heater comprises an injection block including a resin inlet hole on one side to receive a molten resin from an injection cylinder, and dividing and discharging the resin flowed inside through at least one resin discharge hole; a pipe-shaped resin guiding pipe having one end connected to the resin discharge hole to have the resin moved to a resin flow path formed inside, and including a heater radiating heat by receiving power on the outer surface; a nozzle block connected to the other side of the resin guiding pipe, and discharging the resin supplied with the resin through the resin flow path, and including a nozzle installation hole discharging the received resin while connected to the nozzle one side; and a heat expansion compensating connector having both ends assembled with a resin discharge hole of the injection block and one end of the resin guiding pipe by screw, formed with a metal having relatively higher thermal expansivity compared with the injection block and the resin guiding pipe, and including a resin flow path having diameter same as the resin flow path inside. |
