| 发明名称 |
Packages and Packaging Methods for Semiconductor Devices, and Packaged Semiconductor Devices |
| 摘要 |
Packages and packaging methods for semiconductor devices, and packaged semiconductor devices are disclosed. In some embodiments, a package for a semiconductor device includes a molding compound and a plurality of through-vias disposed in the molding compound. The package includes an interconnect structure disposed over the plurality of through-vias and the molding compound. The interconnect structure includes a metallization layer. The metallization layer includes a plurality of contact pads and a fuse. |
| 申请公布号 |
US2015294939(A1) |
申请公布日期 |
2015.10.15 |
| 申请号 |
US201414252625 |
申请日期 |
2014.04.14 |
| 申请人 |
Taiwan Semiconductor Manufacturing Company, Ltd. |
发明人 |
Yu Chen-Hua;Jeng Shin-Puu;Chen Hsien-Wei;Yeh Der-Chyang;Su An-Jhih |
| 分类号 |
H01L23/525;H01L23/48;H01L23/528;H01L25/065;H01L21/56;H01L21/768;H01L25/00;H01L23/31;H01L23/58 |
主分类号 |
H01L23/525 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A package for a semiconductor device, comprising:
a molding compound; a plurality of through-vias disposed in the molding compound; and an interconnect structure disposed over the plurality of through-vias and the molding compound, the interconnect structure comprising a metallization layer, the metallization layer comprising a plurality of contact pads and a fuse. |
| 地址 |
Hsin-Chu TW |
