| 发明名称 |
METHODS OF TESTING PATTERN RELIABILITY AND SEMICONDUCTOR DEVICES |
| 摘要 |
Provided are methods of testing pattern reliability and methods of testing a semiconductor device using the same. A method of testing pattern reliability may include acquiring an optical image of a wafer on which a plurality of patterns are formed, evaluating degrees of damage of ones of the plurality of patterns based on the optical image, determining a respective reliability of the ones of the plurality of patterns according to the evaluated respective degrees of damage, and mapping the reliability of the ones of the plurality of patterns based on locations of the respective patterns on the wafer. |
| 申请公布号 |
US2015294455(A1) |
申请公布日期 |
2015.10.15 |
| 申请号 |
US201414581232 |
申请日期 |
2014.12.23 |
| 申请人 |
Samsung Electronics Co., Ltd. |
发明人 |
LEE Jeong-Jin;OH Seung-Hwa;HWANG Chan |
| 分类号 |
G06T7/00;G06T1/00;G06K9/46;H01L23/544;G01N21/88 |
主分类号 |
G06T7/00 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A method of testing pattern reliability, comprising:
acquiring an optical image of a wafer on which a plurality of patterns are formed; evaluating respective degrees of damage of ones of the plurality of patterns based on the optical image; determining a respective reliability of the ones of the plurality of patterns according to the evaluated respective degrees of damage; and mapping the reliability of the ones of the plurality of patterns based on locations of the respective patterns on the wafer. |
| 地址 |
Suwon-si KR |
