METHODS AND APPARATUS FOR RAPIDLY COOLING A SUBSTRATE

摘要

Methods and apparatus for rapidly cooling a substrate are provided herein. In some embodiments, a cooling chamber includes: a chamber body having an inner volume; a substrate support disposed in the volume and having a substrate support surface; a plate disposed in the chamber body opposite the substrate support and movable with respect to the substrate support between a first position and a second position, wherein the first position disposes the substrate support and plate away from each other to expose the support surface to a first volume, and the second position disposes the substrate support and plate adjacent to each other to expose the support surface to a second volume smaller than the first volume; a plurality of flow channels disposed in one or more of the plate or the substrate support to flow a coolant; and a gas inlet to provide a gas into the second volume.