SENSOR

摘要

This sensor is provided with an upper cover layer, a lower cover layer, and a sensor layer situated between the upper cover layer and the lower cover layer. Either the upper cover layer or the lower cover layer has a insulation region in which the principal component is glass, a through-electrode covered by the insulation region, and an outside peripheral region in which the principal component is Si, situated to the outside periphery of the insulation region. With this sensor, the outside dimensions of the wafer serving as the material for the sensor can be smaller.