| 摘要 |
A testing device (1) and a method for contactless testing of a conductive interconnect (21) on a circuit board (20) is disclosed. A signal generator (9) is configured to generate an input signal (Si) to be transmitted from a first terminal (6) to a second terminal (7) via a conductive sensing path (5). A processing circuitry (11) is configured to receive an output signal (So) at the second terminal (7) and to determine a property of the conductive interconnect (21) based on the output signal (So), where the conductive sensing path (5) is parallel displaced relative to the conductive interconnect (21), along a direction perpendicular to a parallel plane to the conductive interconnect (21), and where the conductive sensing path (5) forms a galvanically isolated connection with the conductive interconnect (21). |
