发明名称 PRINTED CIRCUIT BOARD FOR MOUNTING CHIP AND METHOD OF MANUFACTURING THE SAME
摘要 A printed circuit board for mounting a chip includes: a core layer including a chip mounting cavity; a chip mounted into the chip mounting cavity; a first insulating material layer filled in a space between the chip mounting cavity and the chip; and a second insulating material layer laminated on one surface of the core layer.
申请公布号 US2015296624(A1) 申请公布日期 2015.10.15
申请号 US201314438660 申请日期 2013.05.09
申请人 LG INNOTEK CO., LTD. 发明人 An Yun Ho;Jung Won Suk;Kim Ran;Park Sung Soo;Son Young Joon;Lee Sang Myung;Lee Woo Young;Han Joon Wook
分类号 H05K1/18 主分类号 H05K1/18
代理机构 代理人
主权项
地址 Seoul KR