发明名称 |
PRINTED CIRCUIT BOARD FOR MOUNTING CHIP AND METHOD OF MANUFACTURING THE SAME |
摘要 |
A printed circuit board for mounting a chip includes: a core layer including a chip mounting cavity; a chip mounted into the chip mounting cavity; a first insulating material layer filled in a space between the chip mounting cavity and the chip; and a second insulating material layer laminated on one surface of the core layer. |
申请公布号 |
US2015296624(A1) |
申请公布日期 |
2015.10.15 |
申请号 |
US201314438660 |
申请日期 |
2013.05.09 |
申请人 |
LG INNOTEK CO., LTD. |
发明人 |
An Yun Ho;Jung Won Suk;Kim Ran;Park Sung Soo;Son Young Joon;Lee Sang Myung;Lee Woo Young;Han Joon Wook |
分类号 |
H05K1/18 |
主分类号 |
H05K1/18 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
Seoul KR |