ENCAPSULATED MOLDED PACKAGE WITH EMBEDDED ANTENNA FOR HIGH DATA RATE COMMUNICATION USING A DIELECTRIC WAVEGUIDE

摘要

In described examples, an encapsulated integrated circuit (710) has transceiver circuitry operable to produce and/or receive a radio frequency (RF) signal. Bond pads on the integrated circuit die (711) are coupled to the transceiver circuitry. An antenna structure (720) is coupled (722) to the transceiver circuitry via the bond pads. Mold material (713) encapsulates the integrated circuit die (711) and the antenna structure (720). The antenna structure (720) is positioned to be approximately in alignment with a core (732) of a dielectric waveguide (730) positioned adjacent the encapsulated integrated circuit (710).