| 摘要 |
<P>PROBLEM TO BE SOLVED: To make joining accuracy between respective regions higher, in division exposure for dividing a chip pattern into a plurality of regions, exposing the respective regions separately and joining the respective regions to each other. <P>SOLUTION: In the formation of an alignment mark for performing alignment, when divided pattern regions are exposed, at least one or more pairs of alignment marks in X and Y directions are provided in the vicinity of the circumference of the precedent divided exposure region, the following divided exposure region has a duplicate region including at least a pair of alignment marks being in the vicinity of the circumference of the precedent divided exposure region, and the process that the alignment is performed by an alignment mark coordinate viewed from the following exposure region is repeated to provide the alignment mark for all divided pattern regions of the chip pattern. Further, in the exposure of a superimposed layer, the alignment is performed with respect to the alignment mark for exposing each divided pattern region provided with high arrangement accuracy by using a die-by-die alignment method. <P>COPYRIGHT: (C)2012,JPO&INPIT |
