发明名称 銅及び銅合金のエッチング方法
摘要 The present invention is concerned with improved means for etching circuit structures on printed circuit board or wafer substrates of copper or copper alloys in a manner effectively removing unwanted copper from such circuit structures leaving behind a smooth copper surface applying an etching solution containing an Fe(ll) / Fe(lll) redox system and sulfur containing organic additives. It is an advantage of the present invention that the solution can also applied for plating of copper prior to etching.
申请公布号 JP5795059(B2) 申请公布日期 2015.10.14
申请号 JP20130512871 申请日期 2011.05.31
申请人 アトテツク・ドイチユラント・ゲゼルシヤフト・ミツト・ベシユレンクテル・ハフツングAtotech Deutschland GmbH 发明人 村主 欣久;松本 英樹;犬塚 真博
分类号 C23F17/00;C23F1/18;C25D3/38;C25D5/48;C25D7/00;C25D7/12;H01L21/306;H01L21/3205;H01L21/3213;H01L21/768;H01L23/522;H01L23/532;H05K3/06 主分类号 C23F17/00
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