发明名称 |
銅及び銅合金のエッチング方法 |
摘要 |
The present invention is concerned with improved means for etching circuit structures on printed circuit board or wafer substrates of copper or copper alloys in a manner effectively removing unwanted copper from such circuit structures leaving behind a smooth copper surface applying an etching solution containing an Fe(ll) / Fe(lll) redox system and sulfur containing organic additives. It is an advantage of the present invention that the solution can also applied for plating of copper prior to etching. |
申请公布号 |
JP5795059(B2) |
申请公布日期 |
2015.10.14 |
申请号 |
JP20130512871 |
申请日期 |
2011.05.31 |
申请人 |
アトテツク・ドイチユラント・ゲゼルシヤフト・ミツト・ベシユレンクテル・ハフツングAtotech Deutschland GmbH |
发明人 |
村主 欣久;松本 英樹;犬塚 真博 |
分类号 |
C23F17/00;C23F1/18;C25D3/38;C25D5/48;C25D7/00;C25D7/12;H01L21/306;H01L21/3205;H01L21/3213;H01L21/768;H01L23/522;H01L23/532;H05K3/06 |
主分类号 |
C23F17/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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